Japan, Aug. 6 -- HUAWEI TECHNOLOGIES CO LTD has got intellectual property rights for 'PICTURE PREDICTION METHOD AND DEVICE.' Other related details are as follows: Application Number: JP,2024-164149 ... Read More
Japan, Aug. 6 -- TOYOTA INDUSTRIES CORP has got intellectual property rights for 'POWER CONVERSION DEVICE.' Other related details are as follows: Application Number: JP,2023-091764 Category (FI): H0... Read More
Japan, Aug. 6 -- TOYOTA MOTOR CORP has got intellectual property rights for 'CONTROL DEVICE FOR INTERNAL COMBUSTION ENGINE.' Other related details are as follows: Application Number: JP,2023-091686 ... Read More
Japan, Aug. 6 -- EBARA CORP,TOKAI NATIONAL HIGHER EDUCATION & RESEARCH SYSTEM has got intellectual property rights for 'METHOD FOR DEPOSITING PROTECTIVE FILM IN OUTER PERIPHERAL PART OF SUBSTRATE INCL... Read More
Japan, Aug. 6 -- JFE ENGINEERING CORP has got intellectual property rights for 'COLUMNAR STRUCTURE TOPPLING PREVENTION STRUCTURE AND EXCAVATION TRENCH OPENING METHOD.' Other related details are as fol... Read More
Japan, Aug. 6 -- DENSO CORP has got intellectual property rights for 'WIRELESS COMMUNICATION SYSTEM AND WIRELESS COMMUNICATION METHOD.' Other related details are as follows: Application Number: JP,20... Read More
Japan, Aug. 6 -- YOKOGAWA ELECTRIC CORP has got intellectual property rights for 'ELECTRONIC APPARATUS.' Other related details are as follows: Application Number: JP,2023-088093 Category (FI): H05K5... Read More
Japan, Aug. 6 -- TDK CORP has got intellectual property rights for 'POSITION DETECTION DEVICE, LENS MODULE AND IMAGING DEVICE.' Other related details are as follows: Application Number: JP,2023-08669... Read More
Japan, Aug. 6 -- TOYOTA MOTOR CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING SOFT-MAGNETIC MATERIAL LAMINATE BODY.' Other related details are as follows: Application Number: ... Read More
Japan, Aug. 6 -- DENSO CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2023-085780 Category (FI): H01L23/28@A,H10B8... Read More